Display device

ABSTRACT

Let a drive circuit chip shrink in outer shape size to thereby enable miniaturization of a display device as a whole. 
     The display device is equipped with a plurality of pixels disposed on a substrate in the form of a matrix and more than one drive circuit chip GDR as mounted on the substrate for causing these pixels to perform a display operation, wherein the drive circuit chip GDR has a plurality of output terminals OT for connection to output wiring lines GL formed on the substrate and a plurality of dummy terminals DT disposed adjacent to one another, and wherein at least one of the output wiring lines GL connected to the output terminals OT is not connected to any one of the dummy terminals DT and is disposed to pass through between the mutually adjacent dummy terminals DT.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation application of U.S. application Ser.No. 11/204,108 filed on Aug. 16, 2005, which is a Continuationapplication of U.S. application Ser. No. 10/230,218 filed on Aug. 29,2002. Priority is claimed based on U.S. application Ser. No. 11/204,108filed on Aug. 16, 2005, which claims priority to U.S. application Ser.No. 10/230,218 filed Aug. 29, 2002, which claims priority to JapanesePatent Application No. 2001-293896 filed on Sep. 26, 2001, all of whichis incorporated by reference.

BACKGROUND OF THE INVENTION

The present invention relates generally to display devices and, moreparticularly, to a display device of the so-called panel type having aplurality of picture elements or “pixels” which are disposed on asubstrate in a matrix form and more than one drive circuit chip fordriving these pixels.

Light weight and slim size of display devices of the panel type arepresently used as display devices for personal computers (PCs) andhandheld or “mobile” wireless telephone handsets plus mobile electronicinformation terminals such as personal digital assistant (PDA) tools andalso as monitors of a variety of types of information equipment.Currently known examples of such panel-type display devices includeliquid crystal display (LCD) panels, electro-luminescence (EL) panels,plasma panels, and field emission display (FED) devices with more thanone carbon nano-tube (CNT) or the like as the electron source thereof.

A typical one of the panel-type display devices of this type is designedso that a plurality of pixels are disposed in the form of a matrix at agape space between a pair of spatially adhered substrates to therebyprovide a display region while mounting drive circuitry for driving thepixels outside of the display region. The pixels which are laid out inthe matrix form are disposed at cross points or “intersections” betweena group of parallel drive lines extending in one direction of asubstrate surface and a group of drive lines extending in anotherdirection crossing this direction, respectively. Although various pixeldesign methods are presently available, one approach is to employ asimple matrix scheme which utilizes voltage superposition at anintersection between the both drive lines. Another approach is to use anactive matrix scheme which performs selection on a per-pixel basis toturn on.

In recent years, the active matrix scheme for performing selection inunits of pixels to turn on is accepted among those skilled in the art asthe major approach from viewpoints of enhanced performances, such asimage resolutions, contrasts and operation speeds. In display devices ofany scheme also, more than one drive circuit is provided outside of thedisplay region in order to supply a drive voltage or display signal to arespective one of the drive lines. Typically this type of drive circuitis provided in the form of a semiconductor chip (referred to as “drivecircuit chip” hereinafter) on a substrate or alternatively at theperiphery of such substrate.

A typical liquid crystal display device of the type using the activematrix scheme is arranged to have a pair of substrates spatially bondedtogether with a layer of liquid crystal material filled in a thin gapspace therebetween, wherein one substrate has its inner surface on whichswitching elements for pixel selection use and scan lines for applying ascan voltage(s) to the switching elements along with data lines fordisplay data application and pixel electrodes or the like are formedwhereas the other substrate comes with opposite or “counter” electrodesopposing the pixel electrodes or a color filter(s) or the like as formedthereon. Here, letting a widely used liquid crystal display device withthin-film transistors (TFTs) as the switching elements be an example, anarrangement of its drive circuit chip will be explained below. Due tothis, an explanation will be given under an assumption that the scanlines for scan voltage application are regarded as gate lines whereasthe data lines for display data application are drain lines.

FIG. 7 is a diagram showing a pictorial representation for explanationof an arrangement of a ventral surface (parts-mount face) of a gatedrive circuit chip which applies a drive voltage to the gate lines—thisis one of the drive circuits for drive voltage application to the drivelines of a liquid crystal display device—along with an example of aprinted wiring line layout as formed on a substrate. The gate drivecircuit chip (simply referred to as “drive circuit chip” alsohereinafter) GDR which is indicated by solid external shape lines oroutlines has on its ventral surface a great number of input terminals ITand multiple output terminals OT along with dummy terminals DT, whereinthis ventral surface is mounted onto a substrate with input wiring linesITL and gate wiring lines GL formed thereon. The terminals of this typeare also called bumps.

In this example, the input terminals IT are organized into two lineararrays disposed along the opposite peripheral edges-namely, the rightand left side edges when seeing the attached drawing sheet of FIG. 7—ofthe drive circuit chip GDR. The input wiring lines ITL are formed on thesubstrate side in a way corresponding to the input terminals IT.optionally, another example is available in which the input terminals ITare modified to reach up to the right and left ends of a lowerperipheral-edge of the drive circuit chip GDR. The output terminals OTfor connection to the gate lines GL as formed in the display regionplaced at upper part of FIG. 7 are located at an upper peripheral edgeof the drive circuit chip GDR, with the dummy terminals DT being formedalong a lower peripheral edge thereof.

As shown in FIG. 10, a gate line GL which extends from the displayregion is connected to an output terminal OT that is formed on the drivecircuit chip GDR and extends so that it runs beneath the ventral surfaceof the drive circuit chip GDR to reach a terminate end face of thesubstrate via a dummy terminal DT which is present at the lowerperipheral edge. Note here that at an intermediate manufacturing stageof this display device, an electrical shortcircuiting or shorting lineis provided at a portion which is further below the lower edge, whereinthe above-noted gate line GL is connected to this shorting line. Theshort line is cut and removed away together with the substrate at apre-stage at which it becomes a final product. This arrangement is shownin FIG. 9.

FIGS. 8A and 8B are partial views for explanation of the arrangement ofa portion indicated by arrow “A” in FIG. 7. Additionally, FIG. 9 is amain-part plan view diagram for explanation of an arrangement example atthe intermediate manufacture stage of the substrate which mounts thereonthe drive circuit chip, and FIG. 10 is an explanation diagram of aconnection state of either an output terminal or a dummy terminal of thedrive circuit chip being mounted on the substrate with respect to a gateline. Reference character string “SUB1” designates the substrate (firstsubstrate) used to mount the drive circuit chip; SUB2 indicates anopposite substrate (second substrate); PAD denotes power supply pads; CLis a cut line of the first substrate; SHT, electrical shorting line. Theinput wiring lines ITL are extended toward the power supply pads PAD asformed at a substrate end portion.

As shown in FIGS. 7 to 10, the dummy terminals DT on the lowerperipheral edge side of the drive circuit chip GDR function to take abalance when mounting onto the substrate, together with the outputterminals OT that are present on the upper peripheral edge side. Thedummy terminals DT formed are the same in number as the output terminalsOT, for taking a balance in the above-noted mounting event—morespecifically, for preventing the drive circuit chip GDR from beingmounted with a tilt. As shown in FIGS. 8A-8B, each gate line GL passesthrough a portion overlying the dummy terminal DT at the lower edge ofthe drive circuit chip GDR and is then connected to the shorting lineSHT.

However, when providing the dummy terminals DT at the lower peripheraledge of the drive circuit chip GDR in units of respective gate lines GL,if these are formed in parallel to the aforesaid lower edge as shown inFIG. 8A, then a need is felt to expand the distance of respective gatelines GL in order to prevent unwanted contact between neighboring gatelines GL. As a result, the gate lines GL to be formed within a specifiedrange D decrease in line number; thus, it is required to enlarge thesize in a lateral direction along the lower edge of the drive circuitchip GDR.

Alternatively, as shown in FIG. 8B, when the dummy terminals are formedto have a zigzag shape at the lower peripheral edge of the drive circuitchip GDR while letting the gate lines GL that are formed within thespecified range D be the same in number as the output terminals OT, itis necessary to enlarge an up-down direction size of the drive circuitchip GDR as indicated by an arrow.

In this way, with the prior art layout designs of the dummy terminalsDT, there is a limit to the shrinkage of the outer shape of the drivecircuit chip GDR. This means that it becomes difficult to reduce thearea of the first substrate SUB1 which mounts thereon the drive circuitchip GDR and thus becomes one factor which constitutes a bar tominiaturization or “down-sizing” of the entirety of the display device.

It is therefore an object of the present invention to provide a displaydevice capable of reducing the outer shape size of a drive circuit chipto be mounted on a substrate of the display device to thereby enableminiaturization as a whole.

SUMMARY OF THE INVENTION

To attain the foregoing object, the present invention has its principalfeature in that the dummy terminals to be provided on the drive circuitchip are made greater in layout pitch than the drive lines whilespecifically arranging certain one or ones of the gate lines whichextend at a substrate terminate end to pass through between adjacentones of the dummy terminals. A description of some representativearrangements of this invention is as follows.

(1) In a display device which comprises a plurality of pixels disposedon a substrate in a matrix form and a drive circuit chip as mounted onthe substrate for causing the pixels to perform a display operation,

the drive circuit chip has a plurality of output terminals forconnection to output wiring lines formed on the substrate and aplurality of dummy terminals disposed adjacent to one another, and

at least one wiring line of the wiring lines connected to the outputterminals is not connected to any one of the dummy terminals and israiled to extend between adjacent ones of the dummy terminals.

(2) In (1), the plurality of dummy terminals are substantially equal inlayout pitch to or greater than the output terminals.

(3) In (1) or (2), the drive circuit chip has a total area of allterminals at a peripheral edge with provision of the dummy terminals,wherein the total area is equal to or more than twenty percent or moreof a total area of all terminals at a peripheral edge opposing theabove-noted peripheral edge.

(4) In any one of (1) to (3), the drive circuit chip is arranged so thatthe requisite number of the dummy terminals is one tenth or greater ofthe number of the output terminals.

(5) In any one of (1) to (4), an area per dummy terminal is made greaterthan an area per output terminal.

(6) In any one of (1) to (5), at least one wiring line of the wiringlines connected to the output terminals is connected to none of thedummy terminals and is railed to extend between the mutually adjacentdummy terminals as disposed along a different peripheral edge from aperipheral edge where the at least one wiring line is connected to theoutput terminals.

(7) In any one of (1) to (6), at least one wiring line of the wiringlines connected to the output terminals is wired so that it is connectedto one of the dummy terminals.

(8) In any one of (1) to (7), the drive circuit chip is a scan drivecircuit chip while letting the wiring line extending between themutually adjacent dummy terminals be a scan signal line.

(9) In any one of (1) to (7), the drive circuit chip is a video signaldrive circuit chip while letting the wiring line extending between themutually adjacent dummy terminals be a video signal line.

(10) In any one of (1) to (9), the mutually adjacent dummy terminals aredisposed along a specified peripheral edge which is far from the pixelsat the drive circuit chip.

(11) In any one of (1) to (10), the pixels are designed to employ liquidcrystal cells.

With the use of each of the arrangements stated above, it becomespossible to reduce or shrink the outer shape of the drive circuit chipto thereby enable provision of the intended display device which iscapable of miniaturization as a whole.

It is to be noted that the present invention should not be limited onlyto the above arrangements and may also be applied similarly to caseswhere the drive circuit chip is a data drive circuit (drain drivecircuit) and also applied to a variety of types of large-size andsmall-size display devices. And, needless to say, various modificationsare possible without departing from the technical ideas of the inventionas disclosed herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing a pictorial representation for explanationof an arrangement of the ventral surface of a drive circuit chip whichapplies drive voltages to gate lines and which is one of drive circuitsfor drive voltage application to drive lines of a liquid crystal displaydevice in accordance with a first embodiment of the display device ofthe present invention along with one example of a wiring line layout asformed on a substrate

FIG. 2 is a partial view for explanation of an arrangement of a portionindicated by arrow “A” in FIG. 1.

FIG. 3 is a partial view for explanation of another arrangement of aportion indicated by arrow “A” in FIG. 1.

FIG. 4 is a partial view for explanation of an arrangement of an outputterminal portion of the drive circuit chip in FIG. 1.

FIG. 5 is an explanation diagram of a practical size design example ofgate lines near dummy terminals and the dummy terminals of the drivecircuit chip of the present invention.

FIG. 6 is a plan view diagram for explanation of an arrangement exampleof a liquid crystal display device for use with mobile radiotelephonehandsets, which is a typical example of the display device of thepresent invention.

FIG. 7 is a diagram showing a pictorial representation for explanationof an arrangement of the ventral surface (parts-mount face) of a gatedrive circuit chip for drive voltage application to gate lines—this isone of the drive circuits used to apply a drive voltage(s) to the drivelines of a liquid crystal display device—along with an exemplary layoutof printed wiring lines as formed on a substrate.

FIGS. 8A and 8B are partial views each of which is for explanation ofthe arrangement of a portion indicated by arrow “A” in FIG. 7, whereinFIG. 8A shows a case where the dummy terminals are formed into a singlelinear array whereas FIG. 8B shows a case where the dummy terminals areformed into a zigzag shape.

FIG. 9 is a main-part plan view diagram for explanation of anarrangement example at the intermediate manufacture stage of a substratewhich mounts thereon the drive circuit chip.

FIG. 10 is an explanation diagram of the connection state of either anoutput terminal or a dummy terminal of the drive circuit chip beingmounted on the substrate with respect to a gate line associatedtherewith.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A preferred form of the present invention will now be explained indetail below with reference to the accompanying drawings of anembodiment which applies the invention to a liquid crystal displaydevice. FIG. 1 is a diagram showing a pictorial representation forexplanation of an arrangement of the ventral surface of a drive circuitchip which applies a drive voltage(s) to gate lines and which is one ofdrive circuits for drive voltage application to drive lines of theliquid crystal display device in accordance with a first embodiment ofthe display device of the present invention along with one example of awiring line layout which is formed on a substrate.

A drive circuit chip GDR has on its ventral surface indicated by solidoutlines a great number of input terminals IT normally called bumpsalong with multiple output terminals OT and dummy terminals DT, whichventral surface will be mounted onto a first substrate with input wiringlines ITL and gate wiring lines GL formed thereon.

In this example, it has input terminals IT along the right and leftperipheral side edges of the drive circuit chip GDR when seeing thedrawing. sheet of FIG. 1. The input wiring lines ITL are formed on thesubstrate side in a way corresponding to these input terminals IT. Notethat the same goes with a case where the input terminals IT are providedup to the right and left terminate ends of a lower peripheral edge ofthe drive circuit chip GDR.

The output terminals OT for connection to gate lines GL as formed in adisplay region which is placed at upper part of FIG. 1 although notspecifically depicted herein are located at portions of the upper andright/left peripheral edges of the drive circuit chip GDR, with thedummy terminals DT being formed along the lower edge. Note here that theoutput terminals OT should not be limited to the three-edge layoutdesign such as shown in FIG. 1 and may alternatively be modified so thatthese are provided only at two peripheral edges or a single edge.

FIGS. 2 and 3 are diagrams each of which shows a partial view forexplanation of the arrangement of a portion indicated by arrow “A” inFIG. 1. In addition, FIG. 4 is a partial view for explanation of thearrangement of an output terminal portion of the drive circuit chip. Theoutput terminals OT that are formed at an upper peripheral edge of thedrive circuit chip GDR are formed to have a zigzag shape along thisupper edge for providing a clearance between the neighboring outputterminals OT to thereby prevent unwanted contact between adjacent onesof the output terminals OT.

As shown in FIG. 1, certain ones of the gate lines GL extending from thedisplay region are connected to the output terminals OT which are formedon the drive circuit chip GDR and railed to run under the ventralsurface of the drive circuit chip GDR and then extend up to a terminateend face of the substrate through the dummy terminals DT at the lowerperipheral edge. The other ones of the gate lines GL extending from thedisplay region are connected to the output terminals OT that are formedon the drive circuit chip GDR and are railed to run under the ventralsurface of the drive circuit chip GDR and then pass through between thedummy terminals DT at the lower edge to reach the terminate end face ofthe substrate.

In FIG. 2, the gate lines that extend between the dummy terminals DT toreach the terminate end face of the substrate are set at three lines; inFIG. 3, they are two lines. Optionally the gate line(s) GL extendingbetween the dummy terminals DT with a prespecified pitch D may be set ata single line or more than four lines in accordance with the line widthof the gate line GL used. The pitch D of the dummy terminals DT is madegreater than the pitch of the output terminals OT. The pitch of outputterminals OT is a pitch p1, which is a smaller value that is obtainedwhen measurement is done between inside and outside ones in case theoutput terminals OT are in the zigzag layout (see FIG. 4). Furthermore,it is preferable that the pitch D be made greater than a pitch p2 whichis obtainable when measurement is done between outside ones.

As previously explained in conjunction with FIG. 9, at the intermediatemanufacture stage of this liquid crystal display device, more than oneelectrical shorting line is provided at a further lower portion of thelower peripheral edge of the substrate which mounts thereon the drivecircuit chip GDR, with the above-noted gate lines GL connected to thisshorting line. The short line is to be cut and removed away togetherwith the substrate at a pre-stage at which it becomes a final product.With such an arrangement, at least one of electrostatic remedy,open-circuit inspection and anode oxidation is made possible.

In this way, when railing the gate lines GL through the ventral surfaceof the drive circuit chip GDR, letting specified one or ones of thempenetrate between adjacent ones of the dummy terminals makes it possibleto provide a clearance between wire leads with respect to both the dummyterminals DT and the gate lines GL.

With such the arrangement of this embodiment, no dummy terminals arepresent over the gate lines so that it is possible to acquire a balancein parts-mount events of the drive circuit chip GDR while ensuring thatany adjacent gate lines do not come into contact with each other withoutincreasing the dummy terminals in number. As a result, it is no longerrequired to enlarge the outer shape of the drive circuit chip, which inturn makes it possible to permit the drive circuit chip to shrink inouter shape in accordance with a decrease in line width of the gatelines; thus, it becomes possible to miniaturize the liquid crystaldisplay device as a whole.

In this way, according to the illustrative embodiment, when railing thegate lines GL in such a way as to extend through the ventral surface ofthe drive circuit chip GDR, it is possible to acquire the clearancebetween the dummy terminals DT and the wiring lines GL not by forcingthem to run via the dummy terminals DT without fail but by “thinningout” the dummy terminals DT; thus, it is possible to rail the gate linesGL at high densities. As a result, it becomes possible to shrink theouter shape of the drive circuit chip GDR.

In order to provide the mounting balance (parallelism relative to thesubstrate surface) with respect to the peripheral edge on the outputterminal OT side as a result of the thin-out of the dummy terminals DTof the drive circuit chip GDR, that is, in order to avoid any unwantedinclination or tilting of the drive circuit chip GDR with respect to thesubstrate by application of the compressive force of a thermal adhesiontool upon mounting of the drive circuit chip GDR to the substrate, itshould be required to design a total area of the terminals that arepresent at the peripheral edge along which the dummy terminals DT areprovided (for the one that includes additional terminals such as forexample input terminals IT other than the dummy terminals DT, a total ofsuch input terminals IT and the dummy terminals DT) to have aprespecified significance.

From parts-mounting experiences in actual manufacturing processes, it ispreferable that the total area of the terminals placed at the peripheraledge on the dummy terminal DT side which can hold the parallelismrelative to the substrate surface while withstanding the compressiveforce of the above-stated thermal adhesion tool be set at equal to ormore than twenty percent (20%) of an all-terminal area of the terminalsat an opposite peripheral edge (here, the output terminal OT layoutedge) to the peripheral edge on the dummy terminal DT side, that is, thearea of all the output terminals OT; more preferably, let it be set atequal to or more than 35%. In addition, it is preferable that an upperlimit of the total area of the terminals which reside at the peripheraledge on this dummy terminal side be less than 100%—more preferably,equal to or less than 50% at the maximum in the sense of acquiring thewiring space of the gate lines GL. Note here that if the ability towithstand the compressive force is available then the total terminalarea upper limit may be modified to be out of these numerical valueranges.

Additionally, there is also a remedy which takes into consideration theterminal number of the peripheral edge on the dummy terminal layout sidein order to acquire the above-mentioned mounting balance. The terminalnumber of the peripheral edge on the dummy terminal layout side ispreferably set at a carefully chosen value which is equal to or greaterthan one tenth ( 1/10)—more preferably, equal to or greater than onefifth (⅕)—of the total terminal number of the output terminals OT. In asimilar way to the aforesaid terminal area definition, the upper limitof the terminal number of the peripheral edge on the dummy terminallayout side is preferably less than one time of the total terminalnumber of the output terminals OT; more preferably, the former is equalto or less than one second (½) of the latter. Note that if the abilityto withstand the compressive force is. guaranteed then the upper limitmay be modified to go beyond these numerical value ranges.

FIG. 5 is an explanation diagram of a practical size design example ofgate lines adjacent to dummy terminals and the dummy terminals of thedrive circuit chip of the present invention. Illustrated here is thecase where three gate lines GL extend and penetrate between adjacentdummy terminals DT. The line width of each gate line GL passing betweenthe dummy terminals DT is set at 10 μm, a gap g of the gate lines GL is10 μm, a gap between one dummy terminal DT and an outside one of thegate lines GL passing between the dummy terminals DT is 20 μm, the pitchD between the dummy terminals DT is 120 μm, the width of a dummyterminal DT is 30 μm, and the length of dummy terminals DT along thegate lines GL is 100 μm.

The length of the dummy terminals DT along the gate lines GL isspecifically designed to be greater than the length of those terminalslaid out at the output terminal OT layout edge, that is, the outputterminals OT. Additionally the length of the output terminals OT is 95μm, the width is 30 μm, the pitch p1 of FIG. 4 is equal to 40 μm, andthe pitch p2=80 μm. This length of the dummy terminals DT is set up inaccordance with the number of the terminals placed at the dummy terminallayout edge whereas the area of dummy terminal DT is set in such a waythat it is well balanced with the output terminal OT layout edge duringmounting. In this way, letting the area per dummy terminal be greaterthan the area per output terminal OT makes it possible to establishenhanced balance equilibrium during mounting while using a decreasednumber of dummy terminals. The arrangement is not limited to the designscheme explained above and may be modified so that the same length isused with the area per single terminal equalized.

Although the above-noted embodiment is explained in relation to thedrive circuit chip for gate drive use, the same goes with a drivecircuit chip for drain drive use.

FIG. 6 is a plan view diagram for explanation of an arrangement exampleof a liquid crystal display device for use with a mobile radiotelephonehandset, which is a typical example of the display device of the presentinvention. This liquid crystal display device is arranged by sealing aliquid crystal material into a gap space between a first substrate SUB1and a second substrate SUB2 which are adhered together, railing aplurality of gate lines GL and a plurality of drain lines DL on aninside surface of the first substrate SUB1 into a matrix form, anddisposing at locations in close proximity to the cross-points orintersections thereof a plurality of pixels each having a switchingelement and a pixel electrode into a matrix form to thereby provide adisplay region AR.

The first substrate SUB1 has on its one peripheral edge side a drivecircuit mounting region which is overextended from the second substrateSUB2, wherein a drive circuit chip DDR for drain-line drive use and twoseparate drive circuit chips GDR1, GDR2 for gate-line drive use aremounted in this drive circuit mount region. At the lower terminate endof the drive circuit mount region of the first substrate SUB1, pads PAD1are formed for supplying signals and voltages to the drive circuit chipDDR and the drive circuit chips GDR1, GDR2 for gate-line drive use andalso to opposite or “counter” electrodes and others which are providedon the second substrate SUB2.

These pads PAD1 are such that pads PAD2 of a flexible printed. wiringboard FPC are connected thereto while permitting the above-noted signalsand voltages to be supplied to the pads PAD1 from external signalprocessor circuitry via the flexible printed wiring board FPC. It shouldbe noted that although in FIG. 6 both the drive circuit chip DDR fordrain-line drive use and the two drive circuit chips GDR1, GDR2 forgate-line drive use are mounted in the drive circuit mount region, thetwo drive circuit chips GDR1, GDR2 for gate-line drive use may beintegrated together into a single semiconductor chip (GDR) when the needarises. Alternatively, the drive circuit for gate-line drive use and thedrive circuits for drain-line drive use may be modified so that theseare organized into a single semiconductor chip.

Still alternatively, it is also possible to mount the drive circuit chipDDR for drain-line drive use alone in the drive circuit mount regionwhile mounting the drive circuit chip GDR (or chips GDR1, GDR2) forgate-line drive use on the flexible printed wiring board FPC side.Additionally this type of small size liquid crystal display device isdesigned to have a control circuit such as a timing controller (TCON) orthe like in the drive circuit chip DDR for drain-line drive use whileeliminating the use of any interface circuit board or substrate which iscustomarily employable in large-size liquid crystal display devices.

Obviously, the present invention should not be limited only to theabove-stated small size liquid crystal display device and may also beapplied in a similar way to notebook personal computers (PCs) anddesktop computers and other relatively large sized display devices. Inaddition, with regard to display devices which require illuminationlight rays, the invention is applicable to any types of display devicesincluding but not limited to transmission type ones, reflective ones,partial transmissive ones, or half or semi-transmissive ones.

To make a long story short, even in the case where multiple chipsincluding the drive circuit chip for drain-line drive use and more thanone drive circuit chip for gate-line drive use are mounted along twoperipheral edges of a display device, the embodiment of the instantinvention is applicable in a similar way to the case of extending itsgate lines or drain lines up to a substrate end portion through theventral surface of a drive circuit chip.

Although the above embodiment has been explained with respect to theactive-matrix liquid crystal display (AMLCD) device, it may also beapplied to mounting and wiring processing of drive circuit chips for usein a wide variety of types of display devices including simple-matrixliquid crystal display devices, ones using thin-film diodes as switchingelements, organic ELs, plasma displays, FEDs, and others. Additionallythe substrates for use with these ones should not be limited only toglass plates or glass-based plates and may alternatively be formed ofresin plates depending upon a certain type or types of the displaydevices.

As has been explained above, according to the present invention, itbecomes possible to reduce or shrink or minimize the outer shape of avariety of drive circuit chips to be mounted on the substrate while atthe same time maintaining the balance during mounting onto the substratesurface, which in turn makes it possible to provide the display deviceof low costs which enables achievement of miniaturization or down-sizingas a whole.

1. A display device comprising: first substrate and second substrate toform display panel; the first substrate is wider than the secondsubstrate at one side of the display panel; wherein a drain driver,first gate driver and second gate driver are formed on the firstsubstrate at the one side, and the drain driver is arranged between thefirst gate driver and the second gate driver.
 2. The display deviceaccording to claim 1, wherein the first gate driver, the drain driverand the second gate driver are arranger in straight.
 3. The displaydevice according to claim 1, wherein a length of short side of the firstgate driver, of the drain driver and of the second gate driver are equaland length of the long side of the drain driver is longer than that ofthe first gate driver and that of the second gate driver.
 4. The displaydevice according to claim 1, further comprising a first connecting padregion is formed on the edge of the first substrate, wherein width ofthe first connecting pad region is wider than that of the drain driver.5. The display device according to claim 4, wherein width of the firstconnecting pad region is wider than a width between nearest edges of thefirst gate driver and the second gate driver.
 6. The display deviceaccording to claim 5, wherein width of the first connecting pad regionis wider than a width between most fare edges of the first gate driverand the second gate driver.
 7. The display device according to claim 4,further comprising flexible printed circuit with second connecting padregion to connect the first connecting pad region, wherein width of theflexible printed circuit is wider than that of the first connecting padregion.
 8. The display device according to claim 5, further comprisingflexible printed circuit with second connecting pad region to connectthe first connecting pad region, wherein width of the flexible printedcircuit is wider than that of the first connecting pad region.
 9. Thedisplay device according to claim 6, further comprising flexible printedcircuit with second connecting pad region to connect the firstconnecting pad region, wherein width of the flexible printed circuit iswider than that of the first connecting pad region.
 10. The displaydevice according to claim 2, further comprising a first connecting padregion is formed on the edge of the first substrate, wherein width ofthe first connecting pad region is wider than that of the drain driver.11. The display device according to claim 10, wherein width of the firstconnecting pad region is wider than a width between nearest edges of thefirst gate driver and the second gate driver.
 12. The display deviceaccording to claim 11, wherein width of the first connecting pad regionis wider than a width between most fare edges of the first gate driverand the second gate driver.
 13. The display device according to claim10, further comprising flexible printed circuit with second connectingpad region to connect the first connecting pad region, wherein width ofthe flexible printed circuit is wider than that of the first connectingpad region.
 14. The display device according to claim 11, furthercomprising flexible printed circuit with second connecting pad region toconnect the first connecting pad region, wherein width of the flexibleprinted circuit is wider than that of the first connecting pad region.15. The display device according to claim 12, further comprisingflexible printed circuit with second connecting pad region to connectthe first connecting pad region, wherein width of the flexible printedcircuit is wider than that of the first connecting pad region.
 16. Thedisplay device according to claim 3, further comprising a firstconnecting pad region is formed on the edge of the first substrate,wherein width of the first connecting pad region is wider than that ofthe drain driver.
 17. The display device according to claim 16, whereinwidth of the first connecting pad region is wider than a width betweennearest edges of the first gate driver and the second gate driver. 18.The display device according to claim 17, wherein width of the firstconnecting pad region is wider than a width between most fare edges ofthe first gate driver and the second gate driver.
 19. The display deviceaccording to claim 16, further comprising flexible printed circuit withsecond connecting pad region to connect the first connecting pad region,wherein width of the flexible printed circuit is wider than that of thefirst connecting pad region.
 20. The display device according to claim17, further comprising flexible printed circuit with second connectingpad region to connect the first connecting pad region, wherein width ofthe flexible printed circuit is wider than that of the first connectingpad region.
 21. The display device according to claim 18, furthercomprising flexible printed circuit with second connecting pad region toconnect the first connecting pad region, wherein width of the flexibleprinted circuit is wider than that of the first connecting pad region.